AMD’s Next-Gen Zen 7 “Grimlock” CPUs To Utilize TSMC 1.4nm Process Tech & FOPLP Packaging, Launching in 2028 – Wccftech
AMD’s plans for its future Zen 7 “Grimlock” CPUs have surfaced in recent leaks, pointing to a launch date in 2028. The processors are rumored to feature TSMC’s 1.4 nm process (A14 node) and FOPLP packaging, with up to 32 cores on board.
1 day ago
2 mins read