ROHM has introduced a new top-side cooling package for SiC MOSFETs aimed at boosting device performance. This innovation combines high heat dissipation with high voltage support, reflecting the company’s commitment to meeting the demands of modern power electronics.

Toshiba has introduced a photovoltaic-output photocoupler designed for automotive applications. Housed in a thin package with a long creepage distance and high isolation voltage, this new component underscores Toshiba’s continued focus on electronic advancements for vehicles.